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Honor Magic V3 Global Model Appears on Geekbench; Tipped to Pack Snapdragon 8 Gen 3

By Himani Jha | Updated Aug 12, 2024, 5:33 PM IST
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The Honor Magic V3, the much-anticipated foldable smartphone from Honor, has grabbed the eyeballs after its global model appeared on Geekbench. This has sparked excitement and speculation about the device's performance and features, ahead of its international release. The phone is tipped to get a Snapdragon 8 Gen 3 SoC under the hood. Check out all details here.

Honor Magic V3 Global Model Appears on Geekbench Tipped to Pack Snapdragon 8 Gen 3
Honor Magic V2
Honor Magic V3 which has already been launched in China last month in July, is likely to make its debut in global market as well. The handset could come as the company's next-generation foldable phone. While a teaser has already been dropped on the Honor UK website hinting at a thinner and lighter dimension, the phone is reportedly spotted on Geekbench listing website. The appearance on the performance benchmarking website has leaked some of the key features. Honor is likely to ship the Magic V3 foldable phone with the same specifications as its Chinese variant.

According to the reports, a device has been spotted with the model number "FCP-N49" on Geekbench which also appeared on the Telecommunications And Digital Government Regulatory Authority (TDRA) listing with the Honor Magic V3 moniker. The listing suggests that the phone is most likely to come equipped with an octa core processor that scored 1,914 points in the single-core test, and 5,354 points in the multi-core test. Additionally, the chipset peaked at a clock speed of 3.30GHz, as per the listing.

Other leaked details are an Adreno 750 GPU paired with up to 12GB RAM. All these benchmark numbers, CPU frequency, and GPU information suggest that the Honor Magic V3 will be powered by a Snapdragon 8 Gen 3 SoC under the hood.

Notably, the Honor Magic V3 Chinese variant bears the model number FCP-AN10.

Honor Magic V3 Specifications
The Honor Magic V3 in China sports a 7.92-inch primary LTPO OLED screen and a 6.43-inch LTPO OLED cover display with both displays offering stylus support. The phone is powered by a Snapdragon 8 Gen 3 chipset, paired with up to 16GB of RAM and up to 512GB of storage.

The newly launched handset runs on Android 14-based MagicOS 8.0.1 out-of-the-box. It is equipped with a triple outer camera setup lead by a 50-megapixel primary camera. There is also a 50-megapixel telephoto camera, and a 40-megapixel ultra-wide angle camera. For selfies and video calls, there's a 40-megapixel wide-angle inner camera.

The phone is backed by a 5,150mAh silicon carbon battery with support for 66W wired charging. It also has an IPX8 rating for dust and splash resistance.